专利名称：WAFER BEVEL INSPECTION MECHANISM发明人：Cory M. Watkins申请号：US12296026申请日：20070403
公开号：US20090161094A1公开日：20090625
专利附图：
摘要：An imaging sensor for capturing images of the beveled surface of a wafer edgeis herein disclosed. The imaging sensor is aligned with the edge of a wafer to maximizethe area of the bevel that is encompassed by the depth of view of the imaging sensor.One or more sensors may be used to capture images of the wafer edge.
申请人：Cory M. Watkins
地址：Eden Prairie MN US
国籍：US
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