专利名称：WAFER SEPARATING APPARATUS AND
WAFER SEPARATING METHOD
发明人：MICHIROU YOSHINO,KOJIRO
NAKAMURA,TORU FURUSHIGE
申请号：US14054829申请日：20131016
公开号：US20140130986A1公开日：20140515
专利附图：
摘要：A wafer separating apparatus can separate a plurality of wafers bonded to aslicing base with an adhesive from the slicing base. The apparatus includes: a water tank
configured to store therein water; a retainer configured to retain the slicing base; a firstnozzle configured to apply a jet of water to side of a wafer of the wafers; and a trayconfigured to contain a wafer separated from the slicing base, wherein the tray isdisposed inside the water tank.
申请人：Panasonic Corporation
地址：Osaka JP
国籍：JP
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