专利名称：WAFER BEVEL INSPECTION MECHANISM发明人：WATKINS, CORY申请号：US2007008122申请日：20070403
公开号：WO2007120491A3公开日：20080424
摘要：An imaging sensor for capturing images of the beveled surface of a wafer edgeis herein disclosed. The imaging sensor is aligned with the edge of a wafer to maximizethe area of the bevel that is encompassed by the depth of view of the imaging sensor.One or more sensors may be used to capture images of the wafer edge.
申请人：RUDOLPH TECHNOLOGIES, INC.,WATKINS, CORY
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容