WAFER SEPARATION APPARATUS

专利名称：WAFER SEPARATION APPARATUS发明人：MASATO TSUCHIYA申请号：AU2002349422申请日：20021205

公开号：AU2002349422A1公开日：20040623

摘要：A wafer separation apparatus (2) capable of safely and easily separating a waferat an increased speed. The center portion of the uppermost wafer is pressed by waferpressing means provided on the center portion of the lower surface of a support plate(12) capable of moving vertically. In order to disperse the bending stress of the

uppermost wafer, wafer suction means (22a to 22d) absorbs two or more pairs of suctionpositions, each opposing to each other on the peripheral portion of the upper surface ofthe uppermost wafer, so that the wafer is warped upward at the two or more suctionpositions and fluid is blown into the portion between the lower surface of the uppermostwafer and the upper surface of the lower wafer, thereby lifting the upper most wafer andseparating it.

申请人：MIMASU SEMICONDUCTOR INDUSTORY CO., LTD.

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