Wave soldering with supported inclined wave

专利名称：Wave soldering with supported inclined

wave

发明人：Louis V. Tardoskegyi申请号：US05/543886申请日：19750124公开号：US03989180A公开日：19761102

摘要：Workpieces, such as printed circuit boards, are processed by passing the boardsin contact with a standing wave of molten solder formed by circulating molten solderupwardly through a nozzle to overflow at least one edge thereof to form a standingwave which is accelerated by gravity so as normally to have an upper surface ballisticallycurved in the direction of flow. In accordance with the invention, the undersurface of thestanding wave is supported to have a ballistic curvature, in the direction of flow, such thata major portion of the upper surface of the wave is substantially planar with the cross-sectional area of the wave varying, in the direction of flow, in a manner similar to thevariation of the cross-sectional area of an unsupported wave following a ballistic curve inis trajectory. This results in the upper surface of the wave being substantially planarthroughout a major portion of its length, and inclined downwardly from the horizontal, ata small angle, in the direction of flow of the solder. The angle to the horizontal may bevaried between 3°-10° but preferably is from 4° to 6. degree.. Supporting of the

undersurface of the wave is effected by an extension of at least one wall of the nozzle, inthe direction of solder flow, this extendsion having a ballistic curvature in the direction ofsolder flow of an extent such that the upper surface of the standing wave is substantially

flat and inclined downwardly in the direction of the flow.

申请人：ELECTROVERT MANUFACTURING COMPANY, LIMITED

代理机构：McGlew and Tuttle

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